Mobile Board
Number of layers: single, double or 4 to 10 layers
Copper thickness: 0.5 to 10oz
Laminate material: FR-4, FR-1 or CME-1
Base board thickness: 0.3 to 4.0mm
Surface finishing: OSP, HAL, immersion AU, silver, soft Au, nickel plating and gold finger
Twist: 0.5*37;
Insulation resistance: 10 ohms (11 ohms)
Test voltage: 150 to 300V
Thermal cycling ability: 288 degrees Celsius/5 seconds
Finished board area: 560 x 610mm
Minimum line width and spacing: 0.1/0.1mm
Copper thickness in hole: 25.0*956;m
Minimum pad diameter inner layer: 0.5mm
Minimum hole diameter: 0.25mm
PTH: +0.075mm
NPTH: +0.05mm
Hole location tolerance: +0.075mm
Profile tolerance CNC routing: +0.15
Profile tolerance CNC punching: +0.15
Solder mask bridge ability: 0.1mm
Solder mask rigidity: 6 hours
Solderable test: 245 degrees Celsius/5 seconds
Imcombustibility: 94V
Inner: vacuum/plastic
Outer: standard carton
Thermal cycling ability: 288 degrees Celsius/5 seconds
Finished board area: 560 x 610mm
Minimum line width and spacing: 0.1/0.1mm
Copper thickness in hole: 25.0*956;m
Minimum pad diameter inner layer: 0.5mm
Minimum hole diameter: 0.25mm
PTH: +0.075mm
NPTH: +0.05mm
Hole location tolerance: +0.075mm
Profile tolerance CNC routing: +0.15
Profile tolerance CNC punching: +0.15
Solder mask bridge ability: 0.1mm